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XC6408 Series
28V Operation Voltage Regulator with Voltage Detector
ETR0331-004a
GENERAL DESCRIPTION
The XC6408 series is a positive voltage regulator IC manufactured using CMOS process with 28V operation voltage. The series consists of a voltage reference, an error amplifier, a current limiter, a thermal shutdown circuit and a phase compensation circuit plus a driver transistor. The output voltage and the detect voltage are user selectable in 0.1V increments. The over current protection circuit and the thermal shutdown circuit are built-in. These two protection circuits will operate when the output current reaches current limit level or the junction temperature reaches temperature limit level. The XC6408D series monitors its output voltage and provides reset signal if its output voltage falls below the pre-set voltage. This reset time (release delay time) can be set by an external capacitor. The XC6408E series monitors an external power supply and enables the output to be turned off and the IC becomes a stand-by mode.
APPLICATIONS
Note book computers, PDAs Car audio, Car navigation systems Home appliances Audio visuals, Digital cameras, Video cameras Cordless phones, Wireless communication
FEATURES
Max Output Current Dropout Voltage Input Voltage Range Output Voltage Range Detect Voltage Range High Accuracy(Regulator) (Detector) Low Power Consumption 150mA (VIN=VROUT+3.0V) 175mV @IOUT=20mA (VROUT=12V) 2.0V 2.0V 2.0V 2% 2.5% XC6408D 9.5 XC6408E 8 Operating Temperature Packages Environmentally Friendly -40 +85 A (TYP.) A (TYP.) VROUT=12V, VDF=11V VROUT=12V, VDF=11V 28.0V 18.0V (0.1V increments) 16.0V (0.1V increments)
SOT-89-5, SOT-25, USP-6C EU RoHS Compliant, Pb Free
TYPICAL APPLICATION CIRCUITS
TYPICAL PERFORMANCE CHARACTERISTICS
Supply Current vs. Input Voltage
XC6408E (VROUT=12.0V, VDF=11.0V) 15
Supply ISS(uA) Current: ISS ( A)
10
XC6408D Series
5
0 0 4 8 12 16 20 24 28 VIN(V) Input Voltage: VIN (V)
XC6408E Series
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XC6408 Series
PIN CONFIGURATION
NC
* The dissipation pad for the USP-6C package should be solder-plated in recommended mount pattern and metal masking to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the VSS (No. 5) pin.
PIN ASSIGNMENT
PIN NUMBER SOT-89-5 SOT-25 1 2 3 4 5 5 2 4 3 1 USP-6C 1 5 3 4 6 2 PIN NAME VROUT VSS VSEN Cd VDOUT VIN NC FUNCTIONS VR Output Ground Sense Delay Capacitor VD Output Power Input No connection
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XC6408
Series
PRODUCT CLASSIFICATION
Selection Guide
XC6408D Series XC6408E Series VROUT pin voltage detection, release delay capacitor VSEN pin for external voltage detection, auto power ON/OFF function
Ordering Information
XC6408D DESIGNATOR *1
DESCRIPTION VDOUT Output Configuration Output Voltage Detect Voltage
SYMBOL N Open Drain
DESCRIPTION
-
-
Packages Taping Type (*2)
ER-G MR-G PR-G
Sequential number relating to output voltage and detect voltage (refer to the chart below) VROUT Output Voltage Range: 2.0V 18.0V VDF Detect Voltage Range: 2.0V 16.0V Output voltage and detect voltage can be set in 0.1V increments USP-6C SOT-25 SOT-89-5
VD output logic: Detect is low, Release is High. (*1) The "-G" suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant. (*2) The device orientation is fixed in its embossed tape pocket. For reverse orientation, please contact your local Torex sales office or representative. (Standard orientation: R-, Reverse orientation: L-)
DESIGNATOR
(No. 01
20 is standard voltage)
VDF 2.10 2.50 2.70 2.80 4.10 4.20 6.80 5.00 7.50 10.00 11 12 13 14 15 16 17 18 19 20 VROUT VDF
VROUT 01 02 03 04 05 06 07 08 09 10 2.50 3.00 3.30 3.30 5.00 5.00 8.00 9.00 9.00 12.00
For other voltage, please contact your local Torex sales office or representative.
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XC6408 Series
PRODUCT CLASSIFICATION
XC6408E DESIGNATOR *1
DESCRIPTION VDOUT Output Configuration Output Voltage Detect Voltage
SYMBOL N Open Drain
DESCRIPTION
-
-
Packages Taping Type (*2)
ER-G MR-G PR-G
Sequential number relating to output voltage and detect voltage (refer to the chart below) VROUT Output Voltage Range: 2.0V 18.0V VDF Detect Voltage Range: 2.0V 16.0V Output voltage and detect voltage can be set in 0.1V increments USP-6C SOT-25 SOT-89-5
VD output logic: Detect is low, Release is High. (*1) The "-G" suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant. (*2) The device orientation is fixed in its embossed tape pocket. For reverse orientation, please contact your local Torex sales office or representative. (Standard orientation: R-, Reverse orientation: L-)
DESIGNATOR 01 02 03 04 05 06 07 08 09 10
(No. 01
20 is standard voltage)
VROUT 2.50 3.00 3.30 3.30 5.00 5.00 8.00 9.00 9.00 12.00 VDF 2.10 2.50 2.70 2.80 4.10 4.20 6.80 5.00 7.50 10.00 11 12 13 14 15 16 17 18 19 20 VROUT 2.50 2.50 3.00 3.00 3.30 3.30 5.00 5.00 9.00 12.00 VDF 2.70 2.80 4.10 4.20 4.10 4.20 5.60 6.80 10.00 15.00
For other voltage, please contact your local Torex sales office or representative.
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XC6408
Series
BLOCK DIAGRAMS
XC6408 D Type
XC6408 E Type
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XC6408 Series
ABSOLUTE MAXIMUM RATINGS
XC6408D Series
PARAMETER Input Voltage Delay Capacitor Voltage Delay Capacitor Current VROUT Output Current VDOUT Output Current VROUT Output Voltage VDOUT Output Voltage USP-6C Power Dissipation SOT-25 SOT-89-5 Operating Temperature Range Storage Temperature Range
*1: IOUT Pd / (VIN-VROUT) Please refer to page 30 32 for details.
SYMBOL VIN VCd ICd IROUT IDOUT VROUT VDOUT
RATINGS VSS-0.3 30 VSS-0.3 VIN+0.3 5.0 210
*1
UNITS V V mA mA mA V V
(*2)
20 VSS-0.3 VIN+0.3 VSS-0.3 30 120 1000 (PCB mounted) 250 600 (PCB mounted) 500 1300 (PCB mounted) (*2)
(*2)
Pd
mW
Topr Tstg
-40 +85 -55 +125
o o
C C
*2: The power dissipation figure shown is PCB mounted.
XC6408E
PARAMETER Input Voltage Sense Voltage VROUT Output Current VDOUT Output Current VROUT Output Voltage VDOUT Output Voltage USP-6C Power Dissipation SOT-25 SOT-89-5 Operating Temperature Range Storage Temperature Range
*1: IOUT Pd / (VIN-VROUT) Please refer to page 30 32 for details.
SYMBOL VIN VSEN IROUT IDOUT VROUT VDOUT
RATINGS VSS-0.3 30 VSS-0.3 30 210
*1
UNITS V V mA mA V V
(*2)
20 VSS-0.3 VIN+0.3 VSS-0.3 30 120 1000 (PCB mounted) 250 600 (PCB mounted) 500 1300 (PCB mounted) (*2)
(*2)
Pd
mW
Topr Tstg
-40 +85 -55 +125
o o
C C
*2: The power dissipation figure shown is PCB mounted.
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XC6408
Series
ELECTRICAL CHARACTERISTICS
XC6408D Series
PARAMETER SYMBOL CONDITIONS 2.0VVROUT(T)5.0V Supply Current ISS 5.1VVROUT(T)12.0V 12.1VVROUT(T)18.0V VR Output Voltage VR Maximum Output Current VROUT(E)
(*2) (*1) (*1) (*1)
Ta=25
MIN. 1.5 2.3 2.5 VROUT(T)x0.98 (*1) (E-1) 150 100 (*1)
TYP. 9.6 10 14.3 VROUT(T) (*1) (E-1) 25 60 90 E-4 E-5 0.05 0.15 100 30 VDF(T) (*1) (E-2) E-3
MAX. 20.5 25.3 28.1 VROUT(T)x1.02 (*1) (E-1) -
UNITS
CIRCUIT
A
IOUT20mA VIN=VROUT(T)+3.0V, (*1) VROUT (T)3.0V VIN=VROUT(T)+3.0V, (*1) VROUT(T)3.0V 1mAIROUT50mA (*1) 2.0VVROUT(T)5.0V
V mA
IROUTMAX
50 120 160 mV mV 0.10 0.30 28.0 VDF(T)x1.025 (*1) (E-2) %/V %/V V ppm/ mA V V 0.1 15.6 mA A ppm/ ms mV
Load Regulation Regulator Block
VROUT
1mAIROUT50mA (*1) 5.1VVROUT (T)12.0V 1mAIROUT50mA (*1) 12.1VVROUT (T)18.0V
Dropout Voltage1 Dropout Voltage2
(*3)
Vdif1 Vdif2 VROUT / VINVROUT(T) VROUT / VINVROUT(T) VIN VROUT / ToprVROUT(T) IRshort VDF(E)
(*2)
IROUT20mA, IROUT 100mA
(*3)
Line Regulation1 Line Regulation2 Input Voltage Output Voltage Temperature Characteristics Short Current VD Detect Voltage Hysteresis Width Detector Block Output Current Output Leakage Current Detect Voltage Temperature Characteristics Release Delay Time Thermal Shutdown Detect Temperature Thermal Shutdown Release Temperature Hysteresis Width
VROUT(T)+2.0VVIN28V IROUT=5mA (*1) VROUT(T)+2.0VVIN28V IROUT=13mA
0.01 0.03 2.0
IROUT20mA, -40Topr85
VDF(T)x0.975 (*1) (E-2)
VHYS IDOUT IDleak VDOUT / ToprVDOUT tPLH TTSD TTSR TTSR- TTSD VIN=3.0V, Cd=0V ,VDS=0.5V VIN=28V, Cd=0V ,VDS28V -40Topr85 Cap=1000pF Junction Temperature Junction Temperature 0.3 3.4 -
0.5 100 6.0 150 125 25
*1: VROUT(T): Nominal output voltage, VDF(T): Nominal detect voltage *2: VROUT(E): Effective output voltage , VDF(E): Effective detect voltage {*5} {*4} VROUT1 } *3: Vdif {V IN1 *4: VROUT1 : In case of VROUT(T) 3.0V, the VOUT1 is equal to 98% of the IROUT(T) when a stabilized input voltage is applied in VROUT(T)+3.0V. In case of VROUT(T) 3.0V, the VOUT1 is equal to 98% of the IROUT(T) when a stabilized input voltage is applied in VROUT(T)+2.0V. *5: VIN1 The input voltage when VROUT1 appears as input voltage is gradually decreased. *6: Unless otherwise stated, VIN=VROUT(T)+2.0V
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XC6408 Series
ELECTRICAL CHARACTERISTICS (Continued)
XC6408E Series
PARAMETER SYMBOL CONDITIONS VSEN=VDF(T)+2V 2.0V VROUT(T) 5.0V VSEN=VDF(T)+2V 5.1V VROUT(T) 12.0V VSEN=VDF(T)+2V 12.1V VROUT(T) 18.0V VSEN=VSS
(*2) (*1) (*1)
Ta=25
MIN. 1.5 2.1 2.2 VROUT(T) 0.98 (*1) (E-1) 150 100 0.01 0.03 2.0 VSEN=VDF(T)+2.0V IROUT 20mA -40 Topr 85 VSEN=VDF(T)+2.0V
(*1)
TYP. 6.5 8 8.5 1.5 VROUT(T) (*1) (E-1) 25 60 90 E-4 E-5 0.05 0.15 100 30 VDF(T) (*1) (E-2) E-3
MAX. 17.6 17.6 17.6 3.9 VROUT(T) 1.02 (*1) (E-1) -
UNITS
CIRCUIT
Supply Current
ISS
(*1)
A
(*1)
VD Supply Current VR Output Voltage
IDSS VROUT(E)
A V
VR Maximum Output Current
IROUTMAX
Load Regulation Regulator Block
VROUT
VSEN=VDF(T)+2.0V IROUT 20mA (*1) VIN=VROUT(T)+3.0V VSEN=VDF(T)+2.0V VROUT(T) 3.0V VIN=VROUT(T)+3.0V VSEN=VDF(T)+2.0V (*1) VROUT(T) 3.0V VSEN=VDF(T)+2.0V 1mA IROUT 50mA (*1) 2.0 VROUT(T) 5.0V VSEN=VDF(T)+2.0V 1mA IROUT 50mA (*1) 5.1 VROUT(T) 12.0V VSEN=VDF(T)+2.0V 1mA IROUT 50mA (*1) 12.1 VROUT(T) 18.0V IROUT IROUT 20mA 100mA
mA 50 120 160 mV mV 0.10 0.30 28.0 VDF(T) 1.025 (*1) (E-2) %/V %/V V ppm / mA V V 0.1 mA A ppm / A mV
Dropout Voltage1 Dropout Voltage2
(*3)
Vdif1 Vdif2 VROUT / VIN VROUT(T) VROUT / VIIN VROUT(T) VIN VROUT / Topr VROUT(T) IRshort VDF(E)
(*2)
(*3)
Line Regulation1 Line Regulation2 Input Voltage Output Voltage Temperature Characteristics Short Current VD Detect Voltage Hysteresis Width Detector Block Output Current Output Leakage Current Detect Voltage Temperature Characteristics SENSE Input Current Thermal Shutdown Detect Temperature Thermal Shutdown Release Temperature Hysteresis Width
VSEN=VDF(T)+2.0V (*1) VROUT(T)+2.0V VIN 28V IROUT=5mA VSEN=VDF(T)+2.0V (*1) VROUT (T)+2.0V VIN 28V IROUT=13mA
(*1)
VDF(T) x 0.975 (*1) (E-2)
VHYS IDOUT IDleak VDOUT / Topr VDOUT ISENSE TTSD TTSR TTSR- TTSD VIN=3.0V, VSEN=VDF(T)-0.4V VDS=0.5V VIN=28V,VSEN=0V,VDS -40 Topr 85
(*1) (*1)
0.3 -
0.5 100 E-6
28V
VSEN=VDF(T)+2V
Junction Temperature Junction Temperature
-
150 125 25
*1: VROUT(T): Nominal output voltage, VDF(T): Nominal detect voltage *2: VROUT(E): Effective output voltage , VDF(E): Effective detect voltage {*5} {*4} VROUT1 } *3: Vdif {V IN1 *4: VROUT1 : In case of VROUT(T) 3.0V, the VOUT1 is equal to 98% of the IROUT(T) when a stabilized input voltage is applied in VROUT(T)+3.0V. In case of VROUT(T) 3.0V, the VOUT1 is equal to 98% of the IROUT(T) when a stabilized input voltage is applied in VROUT(T)+2.0V. *5: VIN1 The input voltage when VROUT1 appears as input voltage is gradually decreased. *6: Unless otherwise stated, VIN=VROUT(T)+2.0V
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XC6408
Series
Voltage Chart
(*1)VROUT: Accuracy SYMBOL
ELECTRICAL CHARACTERISTICS (Continued)
2%, VDF: Accuracy E-1 2.5% E-2 E-3 E-4 DROPOUT VOLTAGE1 IROUT=20mA (mV) Vdif1 MAX. TYP 500 MAX 680 E-5 DROPOUT VOLTAGE2 IROUT=100mA (mV) Vdif2 TYP 2300 MAX 3300 E-6 SENSE INPUT CURRENT A Isense MIN MAX
PARAMETER NOMINAL VDF DETECT VOLTAGE VROUT OUTPUT VOLTAGE
OUTPUT VOLTAGE (V)
DETECT VOLTAGE (V)
HYSTERESIS WIDTH (V)
VROUT(T) VDF(T) 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5 5.6 5.7 5.8 5.9
VROUT(E) MIN. 1.960 2.058 2.156 2.254 2.352 2.450 2.548 2.646 2.744 2.842 2.940 3.038 3.136 3.234 3.332 3.430 3.528 3.626 3.724 3.822 3.920 4.018 4.116 4.214 4.312 4.410 4.508 4.606 4.704 4.802 4.900 4.998 5.096 5.194 5.292 5.390 5.488 5.586 5.684 5.782 MAX. 2.040 2.142 2.244 2.346 2.448 2.550 2.652 2.754 2.856 2.958 3.060 3.162 3.264 3.366 3.468 3.570 3.672 3.774 3.876 3.978 4.080 4.182 4.284 4.386 4.488 4.590 4.692 4.794 4.896 4.998 5.100 5.202 5.304 5.406 5.508 5.610 5.712 5.814 5.916 6.018
VDF(E) MIN. 1.950 2.048 2.145 2.243 2.340 2.438 2.535 2.633 2.730 2.828 2.925 3.023 3.120 3.218 3.315 3.413 3.510 3.608 3.705 3.803 3.900 3.998 4.095 4.193 4.290 4.388 4.485 4.583 4.680 4.778 4.875 4.973 5.070 5.168 5.265 5.363 5.460 5.558 5.655 5.753 MAX. 2.050 2.153 2.255 2.358 2.460 2.563 2.665 2.768 2.870 2.973 3.075 3.178 3.280 3.383 3.485 3.588 3.690 3.793 3.895 3.998 4.100 4.203 4.305 4.408 4.510 4.613 4.715 4.818 4.920 5.023 5.125 5.228 5.330 5.433 5.535 5.638 5.740 5.843 5.945 6.048 MIN.
VHYS
430
600
1950
2950
360
530
1550
2550
250
380
1100
1800
0.1
2.2
VDF(E)x2
VDF(E)x8
230
350
850
1650
180
300
750
1350
0.1
4.1
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XC6408 Series
Voltage Chart (Continued)
(*1)VROUT: Accuracy SYMBOL
PARAMETER NOMINAL
ELECTRICAL CHARACTERISTICS (Continued)
2%, VDF: Accuracy E-1 OUTPUT VOLTAGE (V) VROUT(E) MIN. 5.880 5.978 6.076 6.174 6.272 6.370 6.468 6.566 6.664 6.762 6.860 6.958 7.056 7.154 7.252 7.350 7.448 7.546 7.644 7.742 7.840 7.938 8.036 8.134 8.232 8.330 8.428 8.526 8.624 8.722 8.820 8.918 9.016 9.114 9.212 9.310 9.408 9.506 9.604 9.702 9.800 MAX. 6.120 6.222 6.324 6.426 6.528 6.630 6.732 6.834 6.936 7.038 7.140 7.242 7.344 7.446 7.548 7.650 7.752 7.854 7.956 8.058 8.160 8.262 8.364 8.466 8.568 8.670 8.772 8.874 8.976 9.078 9.180 9.282 9.384 9.486 9.588 9.690 9.792 9.894 9.996 10.098 10.200 MIN. 5.850 5.948 6.045 6.143 6.240 6.338 6.435 6.533 6.630 6.728 6.825 6.923 7.020 7.118 7.215 7.313 7.410 7.508 7.605 7.703 7.800 7.898 7.995 8.093 8.190 8.288 8.385 8.483 8.580 8.678 8.775 8.873 8.970 9.068 9.165 9.263 9.360 9.458 9.555 9.653 9.750 2.5% E-2 DETECT VOLTAGE (V) VDF(E) MAX. 6.150 6.253 6.355 6.458 6.560 6.663 6.765 6.868 6.970 7.073 7.175 7.278 7.380 7.483 7.585 7.688 7.790 7.893 7.995 8.098 8.200 8.303 8.405 8.508 8.610 8.713 8.815 8.918 9.020 9.123 9.225 9.328 9.430 9.533 9.635 9.738 9.840 9.943 10.045 10.148 10.250 160 230 450 950 VDF(E)x2 VDF(E)x8 0.1 4.1 160 260 650 1150 180 300 750 1350 MIN. E-3 HYSTERESIS WIDTH (V) VHYS MAX. E-4 DROPOUT VOLTAGE1 IROUT=20mA (mV) Vdif1 TYP MAX E-5 DROPOUT VOLTAGE2 IROUT=100mA (mV) Vdif2 TYP MAX E-6 SENSE INPUT CURRENT A Isense MIN MAX
VDF
DETECT VOLTAGE
VROUT
OUTPUT VOLTAGE
VROUT(T) VDF(T) 6.0 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 7.0 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 8.0 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.9 9.0 9.1 9.2 9.3 9.4 9.5 9.6 9.7 9.8 9.9 10.0
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XC6408
Series
ELECTRICAL CHARACTERISTICS (Continued)
(*1)VROUT: Accuracy SYMBOL
PARAMETER NOMINAL
2%, VDF: Accuracy E-1 OUTPUT VOLTAGE (V) VROUT(E) MIN. 9.898 9.996 10.094 10.192 10.290 10.388 10.486 10.584 10.682 10.780 10.878 10.976 11.074 11.172 11.270 11.368 11.466 11.564 11.662 11.760 11.858 11.956 12.054 12.152 12.250 12.348 12.446 12.544 12.642 12.740 12.838 12.936 13.034 13.132 13.230 13.328 13.426 13.524 13.622 13.720 MAX. 10.302 10.404 10.506 10.608 10.710 10.812 10.914 11.016 11.118 11.220 11.322 11.424 11.526 11.628 11.730 11.832 11.934 12.036 12.138 12.240 12.342 12.444 12.546 12.648 12.750 12.852 12.954 13.056 13.158 13.260 13.362 13.464 13.566 13.668 13.770 13.872 13.974 14.076 14.178 14.280
2.5% E-2 DETECT VOLTAGE (V) VDF(E) MIN. 9.848 9.945 10.043 10.140 10.238 10.335 10.433 10.530 10.628 10.725 10.823 10.920 11.018 11.115 11.213 11.310 11.408 11.505 11.603 11.700 11.798 11.895 11.993 12.090 12.188 12.285 12.383 12.480 12.578 12.675 12.773 12.870 12.968 13.065 13.163 13.260 13.358 13.455 13.553 13.650 MIN. 10.353 10.455 10.558 10.660 10.763 10.865 10.968 11.070 11.173 11.275 11.378 11.480 11.583 11.685 11.788 11.890 11.993 12.095 12.198 12.300 12.403 12.505 12.608 12.710 12.813 12.915 13.018 13.120 13.223 13.325 13.428 13.530 13.633 13.735 13.838 13.940 14.043 14.145 14.248 14.350 120 170 350 800 0.6 6.6 VDF(E)x1 VDF(E)x7 150 200 400 850 0.1 4.1 VDF(E)x2 VDF(E)x8 MIN. E-3 HYSTERESIS WIDTH (V) VHYS MIN. E-4 DROPOUT VOLTAGE1 IROUT=20mA (mV) Vdif1 TYP MAX E-5 DROPOUT VOLTAGE2 IROUT=100mA (mV) Vdif2 TYP MAX E-6 SENSE INPUT CURRENT A Isense MIN MAX
VDF
DETECT VOLTAGE
VROUT
OUTPUT VOLTAGE
VROUT(T) VDF(T) 10.1 10.2 10.3 10.4 10.5 10.6 10.7 10.8 10.9 11.0 11.1 11.2 11.3 11.4 11.5 11.6 11.7 11.8 11.9 12.0 12.1 12.2 12.3 12.4 12.5 12.6 12.7 12.8 12.9 13.0 13.1 13.2 13.3 13.4 13.5 13.6 13.7 13.8 13.9 14.0
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XC6408 Series
ELECTRICAL CHARACTERISTICS (Continued)
(*1)VROUT: Accuracy SYMBOL
PARAMETER NOMINAL
2%, VDF: Accuracy E-1 OUTPUT VOLTAGE (V) VROUT(E) MIN. 13.818 13.916 14.014 14.112 14.210 14.308 14.406 14.504 14.602 14.700 14.798 14.896 14.994 15.092 15.190 15.288 15.386 15.484 15.582 15.680 15.778 15.876 15.974 16.072 16.170 16.268 16.366 16.464 16.562 16.660 16.758 16.856 16.954 17.052 17.150 17.248 17.346 17.444 17.542 17.640 MAX. 14.382 14.484 14.586 14.688 14.790 14.892 14.994 15.096 15.198 15.300 15.402 15.504 15.606 15.708 15.810 15.912 16.014 16.116 16.218 16.320 16.422 16.524 16.626 16.728 16.830 16.932 17.034 17.136 17.238 17.340 17.442 17.544 17.646 17.748 17.850 17.952 18.054 18.156 18.258 18.360
2.5% E-2 DETECT VOLTAGE (V) VDF(E) MIN. 13.748 13.845 13.943 14.040 14.138 14.235 14.333 14.430 14.528 14.625 14.723 14.820 14.918 15.015 15.113 15.210 15.308 15.405 15.503 15.600 MAX. 14.453 14.555 14.658 14.760 14.863 14.965 15.068 15.170 15.273 15.375 15.478 15.580 15.683 15.785 15.888 15.990 16.093 16.195 16.298 16.400 120 170 350 800 VDF(E)x1 VDF(E)x7 0.6 6.6 MIN. E-3 HYSTERESIS WIDTH (V) VHYS MAX. E-4 DROPOUT VOLTAGE1 IROUT=20mA (mV) Vdif1 TYP MAX E-5 DROPOUT VOLTAGE2 IROUT=100mA (mV) Vdif2 TYP MAX E-6 SENSE INPUT CURRENT A Isense MIN MAX
VDF
DETECT VOLTAGE
VROUT
OUTPUT VOLTAGE
VROUT(T) VDF(T) 14.1 14.2 14.3 14.4 14.5 14.6 14.7 14.8 14.9 15.0 15.1 15.2 15.3 15.4 15.5 15.6 15.7 15.8 15.9 16.0 16.1 16.2 16.3 16.4 16.5 16.6 16.7 16.8 16.9 17.0 17.1 17.2 17.3 17.4 17.5 17.6 17.7 17.8 17.9 18.0
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XC6408
Series
OPERATIONAL EXPLANATION
XC6408 D Type XC6408 E Type
The voltage divided by resistors R11 & R12 is compared with the internal reference voltage by the error amplifier. The P-channel MOSFET which is connected to the VROUT pin is then driven by the subsequent output signal. The output voltage at the VROUT pin is controlled and stabilized by a system of negative feedback. The current limit circuit, short protect circuit and thermal protection circuit operate in relation to the level of output current and heat generation. For the XC6408E, regulator operation returns active state when VSEN pin voltage rises higher than the release voltage (*when VSEN pin voltage is higher than detect voltage + hysteresis voltage). The XC6408 series includes a current fold-back circuit as a short circuit protection. When the load current reaches the current limit, the current fold-back circuit starts to operate. As a result, the output voltage drops further and output current decreases. When the VROUT pin is short-circuited, a flow current minimizes to around 30mA. When the junction temperature of the built-in driver transistor reaches the temperature limit level (150 TYP.), the thermal shutdown circuit operates and the driver transistor will be set to OFF. The IC resumes its operation when the thermal shutdown function is released and the IC's operation is automatically restored because the junction temperature drops to the level of the thermal shutdown release voltage. For the stable operation of the IC, over 2.0V of input voltage is necessary. The output voltage may not be generated normally if the input voltage is less than 2.0V.
13/34
XC6408 Series
OPERATIONAL EXPLANATION (Continued)
(XC6408D and XC6408E) The detector function of the XC6408D/E series has hysteresis, and when the detected voltage rises higher than the release voltage (typically about 105% of the detect voltage), the output of the VDOUT pin inverts. (XC6408D) The detector function of the XC6408D series is connected to the VROUT pin inside the IC and detects the VROUT output voltage. The voltage divided by the detector's internal resistance which is connected to the VROUT pin is compared to the IC internal reference voltage, and if the voltage of the VROUT pin falls below the threshold value, low level signal is output from VDOUT. A capacitor (Cd) can be connected to the Cd pin to add a delay time to the output signal of the VDOUT pin at voltage release. The delay time is determined by the constant current value determined by the internal current generator circuit, and the Cd capacitance value. The relationship between the Cd capacitance value and the delay time is shown below. (XC6408E) The detector function of the XC6408E series detects the VSEN pin voltage. The voltage divided by the detector internal resistance that is connected to the VSEN pin is compared to the IC internal reference voltage, and if the voltage of the VSEN pin falls below the threshold value, low level signal is output from VDOUT.
Release Delay Time vs. Cd connected Capacitance
XC6408D
100000 Release Delay TIME(s)
10000
1000
100
10 10 100 1000 Cd connencted Capacitance (pF) 10000
14/34
XC6408
Series
NOTES ON USE
1 2 Please use this IC within the stated absolute maximum ratings. The IC is liable to malfunction should the ratings be exceeded. The power input pin voltage will falls down because of a resistance between power supply and power input pin and shoot through current when IC operates. At this time, if the power input pin voltage is lower than operating voltage range, the IC may cause device malfunction. Please note if the power input pin voltage will fluctuated, the IC may cause device malfunction. If assumed the power input pin voltage falls suddenly (e.g. falls from 28.0V to 0V) at release operation when VD delay capacitor pin is connected to a capacitor, please connect a schottky barrier diode between the power input pin and delay capacitance pin. Please refer below; (XC6408D). for connecting to The VDOUT output is configured as N-ch open drain, so please use a pull-up resistance more than 100k the output pin. * When the pull-up resistor connects to another power supply, high level value will be equal to the voltage which the pull-up resistor is connected. If the input voltage fluctuates more than 1.5V in the speed higher than 100mV/ s, the output voltage may fluctuate widely. In this case, one capacitor should be added between VIN-VSS to adjust the input fluctuation speed less than 100mV/ s. For a delay capacitor pin of the XC6408D is designed in high impedance. When this pin is left open for use, the IC may get noise. It is recommended that a capacitor more than 3pF is connected to the delay capacitor pin. Phase compensation is performed in the XC6408 inside. Therefore, an abnormal oscillation does not occur even if there is no output capacitor CL. An input capacitor CIN around 0.1 F~1.0 F between the VIN pin and the VSS pin is required for input stability. Also, the output voltage fluctuation such as under shoot or over shoot, which occurs because of the load change can be controlled by placing the output capacitor CL around 0.1 F~1.0 F between the VROUT pin and VSS pin. The input capacitor (CIN) and the output capacitor (CL) should be placed to the IC as close as possible with a shorter wiring.
3. 4.
5.
6. 7. 8.
VIN VIN Cd Cap VSS VDOUT
R=100k
VDOUT
e.g. A circuit which delay capacitance pin is connected to a schottky barrier diode.
15/34
XC6408 Series
TEST CIRCUITS
Circuit
D Series E Series
Circuit
D Series E Series
16/34
XC6408
Series
TEST CIRCUITS (Continued)
Circuit
D Series E Series
VIN
VROUT 100k
VIN
VROUT
100k
Cd
VDOUT VSS
VSEN
VDOUT VSS
V
V
CIN:1uF
CIN:1uF
Circuit
D Series E Series
Circuit
D Series
Circuit
E Series
VIN
VROUT 100k
Cd
VDOUT VSS
V
Cap=1000pF
17/34
XC6408 Series
TYPICAL PERFORMANCE CHARACTERISTICS
XC6408 Series (1) Output Voltage vs. Output Current
XC6408D/E (VROUT=2V, VIN=5.0V) 2.5 Output Voltage : VROUT(V) 2.0 1.5 1.0 0.5 0.0 0 50 100 150 200 250 300 Ta=-40 Ta=25 Ta=85
XC6408D/E (VROUT=5.0V, VIN=8.0V) 6.0 5.0 4.0 3.0 2.0 Ta=-40 1.0 0.0 0 50 100 150 200 250 300 Output Current : IROUT(mA) Ta=25 Ta=85
Output Current : IROUT(mA)
Output Voltage : VROUT(V)
XC6408D/E (VROUT=12.0V, VIN=15.0V) 14 12 Output Voltage : VROUT(V) 10 8 6 4 2 0 0 50 100 150 200 Output Current : IROUT(mA) 250 300 Ta=-40 Ta=25 Ta=85
XC6408D/E (VROUT=18.0V, VIN=21.0V) 20.0 18.0 Output Voltage : VROUT(V) 16.0 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 0 50 100 150 200 Output Current : IROUT(mA) 250 300 Ta=-40 Ta=25 Ta=85
(2) Output Voltage vs. Input Voltage
XC6408D/E (VROUT=2.0V, IROUT=5mA)
6 XC6408D/E (VROUT=5.0V, IROUT=5mA)
2.5 Output Voltage : VROUT(V) 2.0 1.5 1.0 0.5 0.0 0 4 8 12 16 20 24 28
0 0 4 8 12 16 20 24 28 Output Voltage : VROUT(V) 5 4 3 2 1 Ta=-40 Ta=25 Ta=85
Ta=-40 Ta=25 Ta=85
Input Voltage : VIN(V)
Input Voltage : VIN(V)
18/34
XC6408
Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
XC6408 Series (2) Output Voltage vs. Input Voltage
XC6408D/E (VROUT=12.0V, IROUT=5mA) 14 Output Voltage : VROUT(V)
XC6408D/E (VROUT=18.0V, IROUT=5A) 20 18 Output Voltage : VROUT(V) 16 14 12 10 8 6 4 2 0 Ta=-40 Ta=25 Ta=85
12 10 8 6 4 2 0 0 4 8 12 16 20 24 28 Input Voltage : VIN(V) Ta=-40 Ta=25 Ta=85
0
5
10
15
20
25
30
Input Voltage : VIN(V)
(3) Dropout Voltage vs. Output Current
XC6408D/E (VROUT=2.0V) 4000 Dropout Voltage : Vdif(mV) 3500 3000 2500 2000 1500 1000 500 0 0 25 50 75 100 125 150
Dropout Voltage : Vdif(mV) 2500 XC6408D/E (VROUT=5.0V)
Ta=-40 Ta=25 Ta=85
2000 1500 1000 500 0 0 25
Ta=-40 Ta=25 Ta=85
50
75
100
125
150
Output Current : IROUT(mA)
Output Current : IROUT(mA)
XC6408D/E (VROUT=12.0V) 2500 Dropout Voltage : Vdif(mV)
Dropout Voltage : Vdif(mV) 2500
XC6408D/E (VROUT=18.0V)
Ta=-40
2000 1500 1000 500 0 0 25
Ta=-40 Ta=25 Ta=85
2000 1500 1000 500 0 0
T=-40 T=25 Ta=85 T=85
Ta=25
50
75
100
125
150
25
50
75
100
125
150
Output Current : IROUT(mA)
Output Current : IROUT(mA)
19/34
XC6408 Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
XC6408 Series (4) Output Voltage vs. Ambient Temperature
XC6408D/E (VROUT=2.0V, IROUT=20mA) XC6408D/E (VROUT=5.0V, IROUT=20mA)
2.20 2.15 2.10 2.05 2.00 1.95 1.90 1.85 1.80 -50 -25 0 25 50 75 100 Ambient Temperature : Ta() Output Voltage : VROUT(V) Output Voltage : VROUT(V)
5.20 5.15 5.10 5.05 5.00 4.95 4.90 4.85 4.80 -50 -25 0 25 50 75 100 Ambient Temperature : Ta()
XC6408D/E (VROUT=12.0V, IROUT=20mA) 12.20 Output Voltage : VROUT(V) Output Voltage : VROUT(V) 12.15 12.10 12.05 12.00 11.95 11.90 11.85 11.80 -50 -25 0 25 50 75 100 Ambient Temperature : Ta() 18.20 18.15 18.10 18.05 18.00 17.95 17.90 17.85 17.80 -50
XC6408D/E (VROUT=18.0V, IROUT=20mA)
-25
0
25
50
75
100
Ambient Temperature : Ta()
(5) Ripple Rejection Ratio
XC6408D/E (VROUT=2.0V, VIN=4.0VDC +0.5Vp-pAC ) (CL=1.0uF(Ceramic), Ta=25) 90 Ripple Rejection Ratio : RR(dB)
XC6408D/E (VROUT=5.0V, VIN=7.0VDC +0.5Vp-pAC ) (CL=1.0uF(Ceramic), Ta=25) 90 Ripple Rejection Ratio : RR(dB)
80 70 60 50 40 30 20 10 0 0.01 0.1 1 Frequency: f (kHz)
IROUT=1mA IROUT=20mA
80 70 60 50 40 30 20 10 0 0.01 0.1 1 Frequency: f (kHz)
IROUT=1mA IROUT=20mA
10
100
10
100
20/34
XC6408
Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
XC6408 Series (5) Ripple Rejection Ratio (Continued)
XC6408D/E (VROUT=12.0V, VIN= 14.0VDC +0.5Vp-pAC ) (CL=1.0uF(Ceramic), Ta=25) 90 Ripple Rejection Ratio : RR(dB) 80 70 60 50 40 30 20 10 0 0.01 0.1 1 Frequency: f (kHz) 10 100
XC6408D/E (VROUT=18.0V, VIN=20.0VDC +0.5Vp-pAC ) (CL=1.0uF(Ceramic), Ta=25) 90 80 70 60 50 40 30 20 10 0 0.01 0.1 1 Frequency: f (kHz) 10 100 IROUT=1mA IROUT=20mA
IROUT=1mA IROUT=20mA
(6) Line Transient Response
XC6408D/E (VROUT=2.0V, IROUT=30mA, tr=tf=5us) (CL=1uF(ceramic), Ta=25) 6 5 Input Voltage : VIN (V) 4 3
VR Output Voltage InputVoltage
Ripple Rejection Ratio : RR(dB)
2.4 Output Voltage : VROUT (V) 2.3 2.2 2.1 2 1.9 1.8
XC6408D/E (VROUT=5.0V, IROUT=30mA, tr=tf=5us) (CL=1uF(ceramic), Ta=25) 9 8 Input Voltage : VIN (V) 7 6
VR Output Voltage InputVoltage
5.4 Output Voltage : VROUT (V) Output Voltage : VROUT (V) 5.3 5.2 5.1 5 4.9 4.8 -2 -1 0 1 2 3 4 5 6 7 Time (ms)
2 1 0 -2 -1 0 1 2 3 4 5 6 7 Time (ms)
5 4 3
XC6408D/E (VROUT=12.0V, IROUT=30mA, tr=tf=5us) (CL=1uF(ceramic), Ta=25) 16 15 Input Voltage : VIN (V)
InputVoltage
XC6408D/E (VROUT=18.0V, IROUT=30mA, tr=tf=5us) (CL=1uF(ceramic), Ta=25)
12.4 12.3 12.2 12.1
VR Output Voltage
22
18.8 18.6
InputVoltage
Output Voltage : VROUT (V)
21 Input Voltage : VIN (V) 20 19
VR Output Voltage
14 13 12 11 10 -2 -1 0 1 2 3 4 5 6 7 Time (ms)
18.4 18.2 18 17.8 17.6 -2 -1 0 1 2 3 4 5 6 7 Time (ms)
12 11.9 11.8
18 17 16
21/34
XC6408 Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
XC6408 Series (7) Load Transient Response
XC6408D/E (VROUT=2.0V, VIN=5.0V, tr=tf=5us) (CIN=CL=1uF(ceramic), Ta=25) 4 Output Voltage : VROUT (V) 3 VR Output Voltage 2 1 VR Output Current 0 -1
-0 .0 02
XC6408D/E (VROUT=5.0V, VIN=7.0V, tr=tf=5us) (CIN=CL=1uF(ceramic), Ta=25) 150 Output Current : IROUT (mA) Output Voltage : VROUT (V) 120 90 60 30 7 6 VR Output Voltage 5 4 VR Output Current 3 2
-0 .0 02
150 120 90 60 30 00 00
0
0 0
00
0
22
0.002
44
0.004
6
0 .00 6
6
8
0 .0 08
8
22
0.0 02
44
0 .00 4
66
0 .0 06
8
0.0 08
8
Time (ms)
Time (ms)
XC6408D/E (VROUT=12.0V, VIN=14.0V, tr=tf=5us) (CIN=CL=1uF(ceramic), Ta=25) 14 Output Voltage : VROUT (V) 13 VR Output Voltage 12 11 10 9
- 0.0 02 0
XC6408D/E (VROUT=18.0V, VIN=20.0V, tr=tf=5us) (CIN=CL=1uF(ceramic), Ta=25)
150
20 Output Voltage : VROUT (V)
Output Current : IROUT (mA)
150 120 VR Output Voltage 90 60 VR Output Current 30 Output Current : IROUT (mA)
120 90 60 VR Output Current 30
19 18 17 16 15
- 0.0 02 0 0 .00 2 0.0 04 0 .0 06 0 .0 08
0 0 00 22
0 .00 2
0 0 0 2
Time (ms)
44
0 .0 04
0.006
6 6
0 .00 8
8 8
4
6
8
Time (ms)
22/34
Output Current : IROUT (mA)
XC6408
Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
XC6408D Series (8) Supply Current vs. Input Voltage
XC6408D (VROUT=2.0V, VDF=2.0V) 25 Supply Current : ISS(uA) Supply Current : ISS(uA) 20 15 10 5 0 0 4 8 12 16 20 24 28 Input Voltage : VIN(V) -40 25 85 25 20 15 10 5 0 0 4 8 12 16 20 24 28 Input Voltage : VIN(V) -40 25 85 XC6408D (VROUT=5.0V, VDF=4.5V)
XC6408D (VROUT=12.0V, VDF=11.0V) 25 Supply Current : ISS(uA)
Supply Current : ISS(uA) 25
XC6408D (VROUT=18.0V, VDF=16.0V) -40 25 85
20 15 10 5 0 0 4 8 12 16 20
-40 25 85
20 15 10 5 0
24
28
0
4
8
12
16
20
24
28
Input Voltage : VIN(V)
Input Voltage : VIN(V)
23/34
XC6408 Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
XC6408E Series (8) Supply Current vs. Input Voltage (Continued)
XC6408E (VROUT=2.0V, VDF=2.0V) 15 Ta=-40 Ta=25 Ta=85 10
15 Ta=-40 Ta=25 Ta=85 10 XC6408E (VROUT=5.0V, VDF=4.5V)
Supply Current : ISS(uA)
5
Supply Current : ISS(uA)
5
0 0 4 8 12 16 20 24 28 Input Voltage : VIN(V)
0 0 4 8 12 16 20 24 28 Input Voltage : VIN(V)
XC6408E (VROUT=12.0V, VDF=11.0V) 15 Ta=-40 Ta=25 Ta=85 10 15
XC6408E (VROUT=18.0V, VDF=16.0V)
Supply Current : ISS(uA)
Supply Current : ISS(uA)
Ta=-40 Ta=25 Ta=85 10
5
5
0 0 4 8 12 16 20 24 28 Input Voltage : VIN(V)
0 0 4 8 12 16 20 24 28
Input Voltage : VIN(V)
24/34
XC6408
Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
XC6408E Series (9) SENSE Current vs. SENSE Voltage
XC6408E (VDF=2.0V) 10.0 10.0 SENSE Current : ISENSE(uA) Ta=-40 Ta=25 Ta=85 SENSE Current : ISENSE(uA) 7.5 Ta=-40 Ta=25 Ta=85 XC6408E (VDF=4.5V)
7.5
5.0
5.0
2.5
2.5
0.0 0 4 8 12 16 20 24 28
0.0 0 4 8 12 16 20 24 28 SENSE Voltage : VSEN(V)
SENSE Voltage : VSEN(V)
XC6408E (VDF=11.0V) 10.0 SENSE Current : ISENSE(uA)
SENSE Current : ISENSE(uA) 10.0
XC6408E (VDF=16.0V)
7.5
Ta=-40 Ta=25 Ta=85
7.5
Ta=-40 Ta=25 Ta=85
5.0
5.0
2.5
2.5
0.0 0 4 8 12 16 20 24 28
0.0 0 4 8 12 16 20 24 28
SENSE Voltage : VSEN(V)
SENSE Voltage : VSEN(V)
25/34
XC6408 Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
XC6408E Series (10) VD Supply Current vs. Input Voltage
XC6408E (VDF=2.0V) 2 VD Supply Current : IDSS(uA)
XC6408E (VDF=4.5V) 2 VD Supply Current : IDSS(uA) Ta=-40 Ta=25 Ta=85
1.5
Ta=-40 Ta=25 Ta=85
1.5
1
1
0.5
0.5
0 0 4 8 12 16 20 24 28
0 0 4 8 12 16 20 24 28 Input Voltage : VIN(V)
Input Voltage : VIN(V)
XC6408E (VDF=11.0V) 2 VD Supply Current : IDSS(uA) 2 VD Supply Current : IDSS(uA) Ta=-40 Ta=25v Ta=85
XC6408E (VDF=16.0V)
1.5
1.5
Ta=-40 Ta=25 Ta=85
1
1
0.5
0.5
0 0 4 8 12 16 20 24 28
0 0 4 8 12 16 20 24 28
Input Voltage : VIN(V)
Input Voltage : VIN(V)
XC6408D Series (11) Cd Pin Current
XC6408D 0.40 0.35 Cd Current : Icd(uA) 0.30 0.25 0.20 0.15 0.10 0.05 0.00 0 4 8 12 16 20 24 28 Ta=-40
XC6408 Series (12) VD N-ch Driver Output Current vs. N-ch Driver VDS
XC6408D/E 25
VD Output Current : IDOUT (mA)
Ta=25 Ta=85
20
15
10 VIN=2.0V VIN=12V VIN=28V 0 5 10 15 20 25 30
5
0
Input Voltage : VIN(V)
VD Output Voltage : VDOUT (V)
26/34
XC6408
Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
XC6408 Series (13) VD N-ch Driver Output Current vs. Input Voltage
XC6408D/E (VDF=2.0V, VDS=0.5V) 0.5 VD Output Current : IDOUT (mA) VD Output Current : IDOUT (mA) Ta=-40 Ta=25 Ta=85 1.5 Ta=-40 Ta=25 Ta=85 XC6408D/E (VDF=12.0V, VDS=0.5V)
0.4
1.2 0.9
0.3 0.2
0.6 0.3
0.1
0.0 0.0 0.5 1.0 1.5 2.0
0.0 0 2 4 6 8 10 12
Input Voltage : VIN (V)
Input Voltage : VIN (V)
(14) Detect Voltage vs. Ambient Temperature Release Voltage vs. Ambient Temperature
XC6408D/E (VDF=2.0V) 2.2 2.15 Release Voltage : VDR(V) Detect Voltage : VDF(V) 2.1 2.05 2 1.95 1.9 1.85 1.8 -50 VDF VDR
Release Voltage : VDR(V) Detect Voltage : VDF(V) 4.95 VDF 4.85 4.75 4.65 4.55 4.45 4.35 4.25 4.15 VDR XC6408D/E (VDF=4.5V)
-25 0 25 50 Ambient Temperature : Ta()
75
100
4.05 -50
-25 0 25 50 Ambient Temperature : Ta()
75
100
XC6408D/E (VDF=11V) 12.1 11.9 11.7 Release Voltage : VDR(V) Detect Voltage : VDF(V) 11.5 11.3 11.1 10.9 10.7 10.5 10.3 10.1 9.9 -50 -25 0 25 50 Ambient Temperature : Ta() 75 100 VDF Release Voltage : VDR(V) VDR Detect Voltage : VDF(V) 17.6 17.2 16.8 16.4 16 15.6 15.2 14.8 14.4 -50
XC6408D/E (VDF=16V) VDF VDR
-25 0 25 50 Ambient Temperature : Ta()
75
100
27/34
XC6408 Series
PACKAGING INFORMATION
USP-6C SOT-25
+0.2 -0.1 2.80.2 1.6
1.10.1
SOT-89-5
(unit : mm)
4.50.1 +0.15 1.6 -0.2 0.420.06 0.420.06 0.420.06 0.4 +0.03 -0.02
(0.4)
0.8 MIN
5
2
4
1.0 4.35 MAX 2.50.1
1
0.420.06
2
0.470.06
3
0.8 MIN
5
5
0.420.06
0.4
+0.03 -0.02
8
8 (0.1)
1.50.1
1.50.1
28/34
1.50.1
1.3MAX
0.2MIN
XC6408
Series
PACKAGING INFORMATION (Continued)
USP-6C Reference Pattern Layout USP-6C Reference Metal Mask Design
2.4 0.45 0.45 0.35
2.3 0.35
1 2 3
0.05 1.0 0.05
6 5 4
1 2 3
0.15 0.8 0.15
6 5 4
29/34
XC6408 Series
PACKAGING INFORMATION (Continued)
USP-6C Power Dissipation Power dissipation data for the USP-6C is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition.
1.
Measurement Condition (Reference data) Condition: Ambient: Soldering: Board: Mount on a board Natural convection Lead (Pb) free Dimensions 40 x 40 mm (1600 mm in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Thickness: Through-hole: Glass Epoxy (FR-4) 1.6 mm 4 x 0.8 Diameter
2
2.
Power Dissipation vs. Ambient temperature Board Mount (Tj max = 125 )
Evaluation Board (Unit: mm)
Ambient Temperature 25 85
Power Dissipation PdmW 1000 400
Thermal Resistance (/W) 100.00
Pd-Ta Pd vs. Ta
Power Dissipation Pd (mW)
1200 1000 800 600 400 200 0 25 45 65 85 Ambient Temperature Ta ( ) Ta 105 125
30/34
PdmW
XC6408
Series
PACKAGING INFORMATION (Continued)
SOT-25 Power Dissipation Power dissipation data for the SOT-25 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition.
1.
Measurement Condition (Reference data) Condition: Ambient: Soldering: Board: Mount on a board Natural convection Lead (Pb) free Dimensions 40 x 40 mm (1600 mm in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces (Board of SOT-26 is used.) Material: Thickness: Through-hole: Glass Epoxy (FR-4) 1.6 mm 4 x 0.8 Diameter
2
Evaluation Board (Unit: mm) mm
2.
Power Dissipation vs. Ambient temperature Board Mount (Tj max = 125 )
Ambient Temperature 25 85
Power Dissipation PdmW 600 240
Thermal Resistance (/W) 166.67
Pd-Ta Pd vs. Ta 700 600 500 400 300 200 100 0 25 45 65 85 Ambient Temperature Ta ( Ta 105
) Power Dissipation Pd (mW) PdmW
125
31/34
XC6408 Series
PACKAGING INFORMATION (Continued)
SOT-89-5 Power Dissipation Power dissipation data for the SOT-89-5 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition.
1.
Measurement Condition (Reference data) Condition: Ambient: Soldering: Board: Mount on a board Natural convection Lead (Pb) free Dimensions 40 x 40 mm (1600 mm in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Thickness: Through-hole: Glass Epoxy (FR-4) 1.6 mm 5 x 0.8 Diameter
2
2.
Power Dissipation vs. Ambient temperature Board Mount (Tj max = 125 )
Evaluation Board (Unit: mm)
Ambient Temperature 25 85
Power Dissipation PdmW 1300 520
Thermal Resistance (/W) 76.92
Pd-Ta Pd vs. Ta
Power Dissipation Pd (mW)
1400 1200 1000 800 600 400 200 0 25 45 65 85 Ambient Temperature Ta ( ) Ta 105 125
32/34
PdmW
XC6408
Series
MARKING RULE
SOT-25, SOT-89-5, USP-6C represents additional function.
SOT25
5 4

MARK D E
PRODUCT SERIES XC6408D*****-G XC6408E*****-G
1
represents combination of output voltage and detect voltage for each IC. Numbers are sequence. MARK 01 PRODUCT SERIES XC6408**01**-G
2
3
SOT89-5
5 2 4
represents production lot number. 01 to 09, 0A to 0Z, 11 to 9Z, A1 to A9, AA to Z9, ZA to ZZ in order. (G, I, J, O, Q, W excepted) *No character inversion used.
1
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USP6C
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XC6408 Series
1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD.
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